| PART |
Description |
Maker |
| AN483 |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
|
SGS Thomson Microelectronics
|
| HT10401LHO |
LCD MODULE(1024 × RGB × 768)with AR Coated Glass Optical Bonding
LCD MODULE(1024 隆驴 RGB 隆驴 768)with AR Coated Glass Optical Bonding
|
HYES Optoelectronics, Inc.
|
| BCM7402 BCM3252 BCM3252KPBG |
DUAL-CHANNEL FRONT-END DOCSIS 2.0 STB IC WITH CHANNEL BONDING
|
Broadcom Corporation.
|
| IS15AACP4CF |
PRECAUTIONS FOR HANDLING & STORAGE
|
List of Unclassifed Manufacturers
|
| AB116 |
Assembly and handling information
|
Lumileds Lighting Compa...
|
| AB115 |
Assembly and Handling Information
|
Lumileds Lighting Compa...
|
| AB108 |
Assembly and Handling Information
|
Lumileds Lighting Compa...
|
| M567 |
CR-15 Package Handling and Mounting Procedure
|
M/A-COM Technology Solutions, Inc.
|
| IDTHS231P16 HS231P16NDGI8 |
HYBRID SWITCH WITH NEGATIVE SIGNAL HANDLING
|
Integrated Device Technology
Integrated Device Techn...
|
| TN1188 |
Chip storage and handling for aerospace products with silver
|
STMicroelectronics
|
| MC4411 AO4411 |
P-Channel 30-V (D-S) MOSFET High power and current handling capability
|
ShenZhen FreesCale Electronics. Co., Ltd
|
| MAX4850ETE |
Dual SPDT Analog Switches with Over-Rail Signal Handling
|
MAXIM INTEGRATED PRODUCTS INC
|
